flip chip bonding

基本解释

• 倒装焊接

英汉例句

双语例句

• To be an advancing technology in capsulation, there is a well developing foreground for the thermosonic flip-chip bonding.
  热超声倒装键合作为前沿封装技术具有良好的发展前景。
• With the Doppler laser vibration measurement system, the vibration velocity curves of the flip chip and tool tip were obtained during thermo-sonic flip chip bonding.
  采用多普勒激光振动测量系统，获得了热超声倒装键合过程中工具末端及芯片的振动速度曲线。

• flip chip bonding更多例句

词组短语

短语

• Direct flip -chip bonding 直接倒装芯片接合
• Flip -chip-bonding equipment 倒装焊设备
• ultrasonic flip -chip bonding 超声倒装焊
• thermosonic flip -chip bonding 热超声倒装键合
• flip -chip-bonding technique 倒装焊技术

• flip chip bonding更多词组

专业释义

电子、通信与自动控制技术

• 倒装式接合（法）
• 倒装焊接（法）