wire bonding
常见例句
- Wire bonding is a critical technique for realizing microwave hybrid circuit.
引线键合是实现微波混合电路的关键技术。 - Gas plasma technology can be used to clean pads prior to wire bonding to improve bond strengths and yields.
气体等离子技术能够用于在引线键合前清洗焊盘以改进键合强度和成品率。 - The result shows that the plastic strain at the heel region induced by wire bonding process, molding process and the thermal stress and strain in solder reflow are the main causes of heel crack.
结果显示由于引线键合工艺、注塑工艺以及回流焊中封装体各部分不同的热膨胀系数引起的热应力和塑性变形是产生引脚跟断裂的主要因素。 - Today, the Commerce Department is informing the member nations of the Coordinating Committee on Multilateral Export Controls (COCOM) that the United States will decontrol the sale of wire-bonding technology to "proscribed destinations, " i.e. the Warsaw Pact.
CENTERFORSECURITYPOLICY: Center For Security Policy - Contending that wire-bonding machines were available to the Soviet Union from non COCOM-controlled foreign sources, Commerce Secretary Robert Mosbacher decided -- despite vigorous objections from the Defense Department and a contrary finding from the U.S. intelligence community -- to utilize his authority under the Export Administration Act to decontrol this technology.
CENTERFORSECURITYPOLICY: Center For Security Policy 返回 wire bonding