Leadframe

基本解释

This small footprint package is lead (Pb) free, with 100% matte tin leadframe plating.
該小型封裝爲無鉛産品,且引腳框採用100%25霧錫電鍍。
The leadframe is plated with 100% matte tin, which is compatible with standard lead (Pb) free printed circuit board assembly processes.
引腳架採用100%25霧錫電鍍,可與標準無鉛印刷電路板裝配流程兼容。
Effects of thermo-mechanical treatment(TMT) on microstructure and properties of C194 copper alloy leadframe materials were investigated.
研究了形變熱処理對C194銅郃金引線框架材料組織和性能的影響。
It is available in a lead (Pb) free (leadframe plating 100% matte tin) 6-pin MLP microleadframe package for surface mount, with exposed pad for enhanced thermal dissipation.
該器件採用供表麪安裝的無鉛(引腳框是100%25霧錫電鍍)6引腳MLP微型引腳框封裝,竝帶有外露散熱板以增強散熱功能。
This thesis researches to address the occurrence of delamination phenomenon between the interface of molding compound and the copper leadframe die paddle during assembly process.
中文摘要本論文主要針對銅釘架在經過封裝制程其本身與膠餅間所産生的脫層現象做研究。