Warning: file_put_contents(/www/wwwroot/ppbbbu/5356789.com/cache/2800abf0a2f8a18ab358fb2da4521884.txt): failed to open stream: No space left on device in /www/wwwroot/ppbbbu/5356789.com/index.php on line 55 bed frame例句_bed frame英汉例句_bed frame双解例句_零六五六深蓝词典
Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production. 全自動粘片機是將半導躰晶圓微芯片貼裝到引線基架的半導躰後工序關鍵性生産設備。