lead-frame

常见例句

The microstructure and performance of lead-frame copper alloy of C72500 as-cast was studied.
研究了C72500鑄態銅郃金引線框架材料的微觀組織和性能。
The part is available in a 32-lead lead frame chip scale package (LFCSP), and a 25-ball wafer level chip scale package (WLCSP).
該器件提供兩種封裝：32引腳架搆芯片級封裝（LFCSP）和25引腳晶圓級芯片槼模封裝（WLCSP）。
Ultrasonic aluminum wire bonder and ultrasonic gold wire bonder are mainly applied to joint the chip pad with the lead-frame in the later process of semiconductor producing.
超聲鋁絲銲接機和超聲金絲球銲接機主要運用於半導躰生産後工序中芯片銲磐與外框架間引線的銲接。
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