ulsi

基本解释

This paper describes the development of phase shifting lithography and its applications in ULSI technology.
本文綜述了相移光刻技術的發展及其在ULSI中的應用。
Dishing problem of copper multilayer interconnection in ULSI was introduced, and the reasons and influencing factors were analyzed.
介紹了ULSI多層銅互連線中的碟形坑問題，對其産生的原因及影響因素進行了分析。
In this thesis, we focuse on the microstructure and stress of ULSI Cu interconnects with their impacts on MTF of the electromigration.
本論文主要研究了ULSI中銅互連線的微觀結搆和應力及其對與電徙動MTF的影響。